IQtouch® Micro
Johnstech's IQtouch® Wafer Test Solutions are based on a tradition of delivering innovative technologies, while providing industry-leading final test expertise.
The new IQtouch® Micro Final Test Probe Arrays, for example, deliver unsurpassed low and stable contact resistance (CRES). This is accomplished through a balanced optimization among several critical and competing engineered parameters, including effective test signal transmission path, probe / wafer interface (“touch”) points and elastomeric web forces, and precision manufactured components for superior X/Y/Z co-planarity. Available in a variety of pitches including 300, 350, and 400 and greater microns the IQtouch Micro is adapting to the changing landscape of semiconductor industry with the adoption of 5G.
Product Engineers and Test Engineers can now leverage a final test probe array that provides lowest and most stable CRES on the market, enabling accurate test results for the most critical test parameters on the most sensitive devices. Well-defined device characterization and corresponding specifications will help differentiate your company’s devices in a highly competitive and fast-moving market.
If you would like a copy of the Maintenance & Inspection Guide for this product, please contact info@johnstech.com. You also may contact your regional sales representative or distributor as well.
| Frequency | 89.9GHz |
| Pitch | ≥ 0.3mm |
| Temperature | -40°C to 125°C |
| Package | WLCSP |
Product Engineers and Test Engineers
Can now leverage a final test probe array that provides lowest and most stable CRES on the market, enabling accurate test results for the most critical test parameters on the most sensitive devices. Well-defined device characterization and corresponding specifications will help differentiate your company’s devices in a highly competitive and fast-moving market.
- Industry’s Lowest CRES
- Stable, Accurate Test Signals
- Predictable Signal Length/Path
- Elastomeric Web Force Control
- Confident Characterization
Production Floor Test Managers
Will achieve higher production floor OEE across all of the wafer probing test platforms with reliably robust technologies that quite simply deliver higher device first pass yields with more equipment uptime because probe cleaning requirements will be less frequent.
- Increase Yields, Less Retest
- Less Cleaning, Simplify Maintenance
- Reliable Probe/Elastomer Dynamics
- Superior Co-Planarity and Witness Marks
- Increase Operational OEE