Featured Content
Addressing Test Challenges with Solid Contact Technology
Presented at the TestConX Workshop, March 2024
by: Brian Sheposh, Sr. Product EngineerOptimal Spring Probe Solutions for Every Application
Presented at TestConX, March 2024
by: Valts Treibergs, Principal Custom Products EngineerEnhancing Semiconductor Test Efficiency: The Johnstech J-Tuning Process
by The Johnstech Engineering Staff
Symposia
Pulsed Current-Carrying Capacity of Small Metallic Conductors as applied to Device Test
Presented at the BiTS Workshop, March 2009
Attendee Choice Award WinnerUnderstanding Specs to Better Simulate Solder-to-Board Performance
Presented at the BiTS Workshop, March 2012
by: Jeff Sherry, PE, MSEE, Senior RF Engineer
Technical Papers
Enhancing Semiconductor Testing: Understanding the Importance of Test Contactor Specifications
by: Johnstech Engineering Staff
Monte Carlo Simulation and Design of Experiments for Improved Pin-Pad Alignment
Presented at the BiTS Workshop, March 2011
by: John DeBauche, Engineer ManagerCan Your Socket Handle the Heat?
Published in Chip Scale Review, March 2011
by: Jeff Sherry, PE, MSEE, Senior RF EngineerThermal Modeling and Analysis of Device-Contactor-Load Board System
by Harlan Faller, PE, Advanced Senior Technologist
Choosing Pulse Parameters for High Current Testing
by Harlan L. Faller, PE, Lead
Designing the Optimal Board for IC Testing
Published in EE-Evaluation Engineering, September 2010
By Jeff Sherry, PE, MSEE, Senior RF EngineerCCC: What is it and Why is it Important to Your Test Outcomes?
by Harlan L. Faller, PE, MSEE and Jeff Sherry, PE, MSEE
Archive
Socket Performance Over Time & Insertion Count with Pb-Free Applications | Download Document | Presented at the BiTS Workshop, March 2006 Award Winning Paper: Best Data Presented |
Challenges of Contacting Lead-Free Devices | Download Document | |
Optimizing the Whole Test System to Achieve Optimal Yields and Lowest Test Costs | Download Document | * This paper is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the products or services of Johnstech International Corporation. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it. |